
Référence fabricant
PIC16LF628AT-I/SO
PIC16 Series 3.5 KB Flash 224 B RAM 20 MHz 8-Bit Microcontroller - SSOP-20
Microchip PIC16LF628AT-I/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
Microchip PIC16LF628AT-I/SO - Caractéristiques techniques
Family Name: | PIC16 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 3.5kB |
RAM Size: | 224B |
Speed: | 20MHz |
No of I/O Lines: | 16 |
InterfaceType / Connectivity: | SCI/USART |
Peripherals: | POR/PWM/Watchdog |
Number Of Timers: | 1 |
Supply Voltage: | 2V to 5.5V |
Operating Temperature: | -40°C to +85°C |
Watchdog Timers: | 1 |
Style d'emballage : | SSOP-20 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1100 par Reel
Style d'emballage :
SSOP-20
Méthode de montage :
Surface Mount