Manufacturer Part #
PIC18F2480T-I/SO
PIC18F Series 16 kB Flash 768 B RAM 40 MHz 8-Bit Microcontroller - SOIC-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1600 per Reel Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC18F2480T-I/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
Microchip PIC18F2480T-I/SO - Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 768B |
| Speed: | 40MHz |
| No of I/O Lines: | 25 |
| InterfaceType / Connectivity: | CAN/I2C/SPI/UART |
| Peripherals: | HLVD/POR/PWM/Watchdog |
| Number Of Timers: | 4 |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-28 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC18F2480T-I/SO is a part of PIC18F series 8-bit Microcontroller. It has 16 Kbytes of lash Program Memory in a 28 Pin SOIC package. It has an industrial temperature ranges from -40°C to +85°C.
The PIC18F2480 is ideal for applications requiring cost-effective, low-power solutions with a robust peripheral set in a small package and having low power, high performance 8-bit MCU with integrated full-speed USB 2.0 with peripheral flexibility.
Features:
- Power-Managed Modes:
- Run: CPU on, Peripherals on
- Idle: CPU off, Peripherals on
- Sleep: CPU off, Peripherals off
- Idle mode Currents Down to 6.1 μA Typical
- Flexible Oscillator Structure:
- Four Crystal modes, up to 40 MHz
- 4x Phase Lock Loop (PLL) – Available for Crystal and Internal Oscillators)
- Two External RC modes, up to 4 MHz
- Two External Clock modes, up to 40 MHz
- Special Microcontroller Features:
- C Compiler Optimized Architecture with Optional Extended Instruction Set
- 100,000 Erase/Write Cycle Enhanced Flash Program Memory Typical
- 1,000,000 Erase/Write Cycle Data EEPROM Memory Typical
- Flash/Data EEPROM Retention: > 40 Years
- Self-Programmable under Software Control
- Priority Levels for Interrupts
- Peripheral Highlights:
- High-Current Sink/Source 25 mA/25 mA
- Three External Interrupts
- One Capture/Compare/PWM (CCP) module
- ECAN Technology Module Features:
- Message Bit Rates up to 1 Mbps
- Conforms to CAN 2.0B Active Specification
- Fully Backward Compatible with PIC18XXX8 CAN modules
- Three Modes of Operation:
- Legacy, Enhanced Legacy, FIFO
- Three Dedicated Transmit Buffers with Prioritization
- Two Dedicated Receive Buffers
Available Packaging
Package Qty:
1600 per Reel
Package Style:
SOIC-28
Mounting Method:
Surface Mount