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Manufacturer Part #
MIC5841YWM-TR
MIC5841 Series 15V 3.3 MHz 8-Bit Serial-Input Latched Driver - SOIC-18
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel Package Style:SOIC-18 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2346 | ||||||||||
Microchip MIC5841YWM-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of MTAI as an additional assembly site for MIC2981/82YWM, MIC2981/82YWM-TR, MIC5841YWM, MIC5841YWM-TR, MIC5842YWM, MIC5842YWM-TR, MIC58P42YWM and MIC58P42YWM-TR catalog part numbers (CPN) available in 18L SOIC (.300in) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date: January 2026
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5841YWM-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--signal-interface--line-driver-or-receiver/mic5841ywm-tr-microchip-5061612
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5841YWM-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--signal-interface--line-driver-or-receiver/mic5841ywm-tr-microchip-5061612
Microchip MIC5841YWM-TR - Technical Attributes
| Supply Voltage: | 15V |
| Operating Temp Range: | -40°C to +85°C |
| Package Style: | SOIC-18 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1000 per Reel
Package Style:
SOIC-18
Mounting Method:
Surface Mount