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ams OSRAM TMF8829 48x32 Multi-Zone Direct Time-of-Flight Sensor

High-resolution multi-zone dToF sensing with long range and on-chip processing

The ams OSRAM TMF8829 is a fully integrated direct Time-of-Flight (dToF) sensor module delivering high-resolution multi-zone depth sensing in a compact 5.7 mm × 2.9 mm × 1.5 mm footprint. Built on SPAD, TDC, and histogram-based technology, the device provides configurable zone resolutions of 8x8, 16x16, 32x32, and 48x32, enabling flexible operation from long-range detection to high-density depth mapping.

The TMF8829 achieves sensing distances from 10 mm up to 11,000 mm with an 80° diagonal field of view (4:3 aspect ratio). All raw data processing is performed on-chip, providing accurate distance measurements with 0.25 mm resolution along with confidence levels, signal amplitude, and ambient light data via its digital interface. Internal histogram processing and peak detection enhance measurement robustness, making the sensor highly tolerant to cover-glass smudges and capable of detecting multiple objects per depth point without compromising accuracy.

Designed for high-speed data communication, the TMF8829 supports both I3C (I²C compatible) and fully featured SPI interfaces for device control and raw data streaming. A VBUS supply pin enables operation with 1.2 V, 1.8 V, or 3 V I/O supplies. Raw histogram data, including peak detection results, can be streamed to the host processor for advanced algorithm development and AI-enabled applications.

With its small module size, wide dynamic range, and high signal-to-noise ratio, the TMF8829 enables precise depth sensing in space-constrained commercial and industrial systems.

Technical Details
Features
  • Direct Time-of-Flight (dToF) sensing with high-sensitivity SPAD
  • Configurable zone resolutions: 8x8, 16x16, 32x32, and 48x32
  • 10 mm to 11,000 mm sensing range
  • 1 cm minimum distance with 0.25 mm resolution
  • 80° diagonal field of view (4:3 aspect ratio)
  • Multi-object detection (up to four objects)
  • Full internal histogram processing
  • High-speed I3C (I²C compatible) and SPI interfaces
  • Raw data streaming
  • Cover-glass smudge tolerance
  • Operating temperature: -40°C to 85°C
  • Compact module: 5.7 mm × 2.9 mm × 1.5 mm
Benefits
  • High SNR and wide dynamic range
  • Long-range, high-frequency measurement
  • Flexible operation (8x8 mode to 48x32 mode)
  • Offloads tasks from host processor
  • Enables AI-based object recognition
  • Supports macro-to-telephoto autofocus
  • Suitable for space-constrained designs
  • Applicable across commercial and industrial systems
Target Markets
Applications
  • Industrial automation
  • Home and building automation
  • Projection and display systems
  • Appliances and power tools
  • Access control and security systems
  • Robotics
  • Computing platforms
  • Mobile devices and wearables
  • Camera enhancement and autofocus
  • 3D sensing applications
Block Diagram

TMF8829 Direct Time-of-Flight Sensor

 

ams OSRAM TMF8829 dToF Sensor | Multi-Zone 3D Depth Sensing for Robotics & Industrial Automation

Evaluation Kits

ams TMF8829_EVM_DB_DEMO Evaluation Kit
The TMF8829 Evaluation Kit comes with everything needed to evaluate the TMF8829 multi-zone direct Time-of-Flight sensors. The evaluation kit comprises of a ToF sensor enclosure and sample glass, USB type A to micro-USB cable, USB Flash drive with EVM GUI software and EVM documentation.
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ams TMF8829_EVM_EB_SHIELD Evaluation Kit
The TMF8829 MCU Shield board is designed to fit the Arduino UNO µC development board format. This board features a small breakaway section which includes the TMF8829 device, the board also features a USB interface to allow direct connection to the evaluation GUI.
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