ams OSRAM TMF8829 48x32 Multi-Zone Direct Time-of-Flight Sensor
High-resolution multi-zone dToF sensing with long range and on-chip processing
The ams OSRAM TMF8829 is a fully integrated direct Time-of-Flight (dToF) sensor module delivering high-resolution multi-zone depth sensing in a compact 5.7 mm × 2.9 mm × 1.5 mm footprint. Built on SPAD, TDC, and histogram-based technology, the device provides configurable zone resolutions of 8x8, 16x16, 32x32, and 48x32, enabling flexible operation from long-range detection to high-density depth mapping.
The TMF8829 achieves sensing distances from 10 mm up to 11,000 mm with an 80° diagonal field of view (4:3 aspect ratio). All raw data processing is performed on-chip, providing accurate distance measurements with 0.25 mm resolution along with confidence levels, signal amplitude, and ambient light data via its digital interface. Internal histogram processing and peak detection enhance measurement robustness, making the sensor highly tolerant to cover-glass smudges and capable of detecting multiple objects per depth point without compromising accuracy.
Designed for high-speed data communication, the TMF8829 supports both I3C (I²C compatible) and fully featured SPI interfaces for device control and raw data streaming. A VBUS supply pin enables operation with 1.2 V, 1.8 V, or 3 V I/O supplies. Raw histogram data, including peak detection results, can be streamed to the host processor for advanced algorithm development and AI-enabled applications.
With its small module size, wide dynamic range, and high signal-to-noise ratio, the TMF8829 enables precise depth sensing in space-constrained commercial and industrial systems.
Technical Details
- Direct Time-of-Flight (dToF) sensing with high-sensitivity SPAD
- Configurable zone resolutions: 8x8, 16x16, 32x32, and 48x32
- 10 mm to 11,000 mm sensing range
- 1 cm minimum distance with 0.25 mm resolution
- 80° diagonal field of view (4:3 aspect ratio)
- Multi-object detection (up to four objects)
- Full internal histogram processing
- High-speed I3C (I²C compatible) and SPI interfaces
- Raw data streaming
- Cover-glass smudge tolerance
- Operating temperature: -40°C to 85°C
- Compact module: 5.7 mm × 2.9 mm × 1.5 mm
- High SNR and wide dynamic range
- Long-range, high-frequency measurement
- Flexible operation (8x8 mode to 48x32 mode)
- Offloads tasks from host processor
- Enables AI-based object recognition
- Supports macro-to-telephoto autofocus
- Suitable for space-constrained designs
- Applicable across commercial and industrial systems
Target Markets
- Industrial automation
- Home and building automation
- Projection and display systems
- Appliances and power tools
- Access control and security systems
- Robotics
- Computing platforms
- Mobile devices and wearables
- Camera enhancement and autofocus
- 3D sensing applications
