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Manufacturer Part #
MIC5239-1.5YS-TR
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2500 per Reel
SOT-223 (TO-261-4, SC-73)
Surface Mount
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COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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PCN Information:
*****FPCN 111176 UPDATE/LOCATION CHANGE*****Revision History:February 27, 2025: Issued initial notification.February 20, 2026: Issued final notification. Attached the Qualification Report. Provided the Estimated First Ship date to be on March 30, 2026. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change:Qualification of HANA as an additional assembly site for selected MIC5233, MIC5239, MIC5209, MIC79050 and MIC5201 device families available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.*Please see documents for additional changes
Description of Change:Microchip has released a new Datasheet for the MIC5239 - Low Quiescent Current 500mA Cap LDO Regulator of devices. Removed ?Automotive Electronics? from the Applications section.Reason for Change: To improve productivity. Date Document Changes Effective: 19 Sep 2025
***UPDATE OF PCN114123***Revision History: June 25, 2025: Issued initial notificationJuly 08, 2025: Re-issued initial notification to update the carrier tape information in the pre and post change summary.Description of Change: Qualification of HANA as an additional final test location for selected MIC2954, MIC2920A, MIC37100, MIC39100, MIC5201, MIC5200, MIC5233, MIC5239, MIC5209 and MIC79050 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying HANA as an additional final test location.
Description of Change: Qualification of HANA as an additional final test location for selected MIC2954, MIC2920A, MIC37100, MIC39100, MIC5201, MIC5200, MIC5233, MIC5239, MIC5209 and MIC79050 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying HANA as an additional final test location.
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.
Description of Change: Qualification of HANA as an additional assembly site for selected MIC5233, MIC5239, MIC5209, MIC79050 and MIC5201 device families available in 3L SOT-223 package.Reason for Change: To improve on-time delivery performance by qualifying HANA as an additional assembly site.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
