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Référence fabricant
ATSAML10E14A-AFT
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2000 par Reel
TQFP-32
Surface Mount
Informations de livraison:
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Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 111567 ***Revision History: March 12, 2025: Issued initial notification.February 04, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on May 07, 2026. Updated the notification subject. Revised affected parts list to add automotive part numbers. Description of Change: Qualification of UMC Fab 8S (U08S) an additional fabrication site for selected ATMPS001D14A, ATSAMD09C1x, ATSAMD09Dxx, ATSAMD10C1x, ATSAMD10D1x, ATSAMD11C14, ATSAMD11D14, ATSAMD20E1x, ATSAMD20G1x, ATSAMD20J1x, ATSAMD21E1x, ATSAMD21G1x, ATSAMD21J1x, ATSAMDA1E1x, ATSAMDA1G1x, ATSAMDA1J1x, ATSAML10D1xx, ATSAML10E1xx, ATSAML11D1xx, ATSAML11E1xx, ATSAML21E1xx, ATSAML21G1xx, ATSAML21J1xx, ATSAML22G1xx, ATSAML22J1xx, ATSAML22N1xx, PD39210, PD69210, PD69220, PD77010, PD77020, PIC32CM1602GV000xx, PIC32CM2532LE000xx, PIC32CM2532LS000xx, PIC32CM3204GV000xx, PIC32CM5164LE000xx, PIC32CM5164LS000xx, PIC32CM2532LE00100, PIC32CM2532LS00100, PIC32CM5164LE00100 and PIC32CM5164LS00100 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying UMC Fab 8S (U08S) as an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: 07 May 2026 (date code: 2619)
Description of Change: Implement new carrier tape pocket design for selected products of 32L and 48L TQFP (7x7x1mm) package at MPHL final test siteReason for Change: To improve manufacturability by implementing new carrier tape design.Estimated First Ship Date: 30 March 2026 (date code: 2614)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMC20E1xx, ATSAMC21E1xx, ATSAMD20E1xx, ATSAMD21E1xx, ATSAMDA1E1xx, ATSAML10E1xx, ATSAML11E1xx, ATSAML21E1xx, PIC32CM1216JH01032, PIC32CM1216MC00032, PIC32CM1602GV00032, PIC32CM2532JH00032, PIC32CM2532JH01032, PIC32CM3204GV00032, PIC32CM3204JH00032, PIC32CM6408JH00032 and PIC32CM6408MC00032 device families available in 32L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 13 October 2025 (date code: 2542)*Revision History: August 27, 2025: Issued final notification. The new die attach material was qualified via PCN #CENO-16EGCZ399 on July 22, 2025.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Microchip has released a new Datasheet for the SAM L10/L11 Family Data Sheet of devices. Notification Status: FinalDescription of Change: Revision H - 06/2023 In addition to the changes listed in the following table, there were numerous typographical updates that were made throughout the document.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
