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Référence fabricant
533287-4
BOX II Assembly 105 Position 2.54 mm Board to Board Receptacle w/Solder Tail
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| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :220 par Tube Méthode de montage :PCB Mount | ||||||||||
| Code de date: | |||||||||||
TE Connectivity 533287-4 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of ChangesMolding supplier to manage both the molding and deflash processes in order to eliminate triangulation and reduce transit time.Reason for Changes:Product improvement. Molding supplier to manage both the molding and deflash processes in order to eliminate triangulation and reduce transit time.
Description of Changesreplace current housing resinReason for Changes:Product improvement. Current resin is being unilaterally obsoleted by resin manufacturer. A drop-in replacement resin of the same brand name and manufacturer has been identified and will be used once a successful first-article has been produced. This resin has the same as or increased performance characteristics, is more readily available, and has no planned obsolesence.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=533287-4&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--dual-in-line-package-sockets/533287-4-te-connectivity-8048547
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=533287-4&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--dual-in-line-package-sockets/533287-4-te-connectivity-8048547
TE Connectivity 533287-4 - Caractéristiques techniques
| Méthode de montage : | PCB Mount |
Emballages disponibles
Qté d'emballage(s) :
220 par Tube
Méthode de montage :
PCB Mount