Référence fabricant
AT24C16C-SSHM-B
AT24C16C Series 16 Kb (2 K x 8) 1.7 V I2C-Compatible Serial EEPROM - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 1802 | ||||||||||
Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Notification subject: Memo # ML01202000QB Final Notice: Qualification of 36.3K process technology for selected Microchip products of the AT24C08C and AT24C16C device families.PCN Status: Final notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of 36.3K process technology for selected Microchip products of the AT24C08C andAT24C16C device families.Pre Change: Available in 35.8K wafer technology fabricated at Microchip fabrication sites FAB 5 (Colorado Springs, CO, USA) using 6 inch wafers.Post Change: Available in 35.8K wafer technology fabricated at Microchip fabrication sites FAB 5 (Colorado Springs, CO, USA) using 6 inch wafers or available at Available in 36.3K wafer technology fabricated at Microchip fabrication sites FAB 5 (Colorado Springs, CO, USA) using 6 inch wafersImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: April 15, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Data Sheet - AT24C16C - Complete DatasheetMicrochip has released a new DeviceDoc for the AT24C16C - Complete Datasheet of devices.Notification Status:FinalDescription of Change:1) Updated to the Microchip template. Microchip DS20006051 replaces Atmel document 8719.2) Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns.3) Updated Part Marking Information.4) Updated the Software Reset section.5) Added ESD rating.6) Removed lead finish designation.7) Updated trace code format in package markings.8) Added a figure for “System Configuration Using 2?Wire Serial EEPROMs”.9) Updated Block Diagram figure.10) Added POR recommendations section.11) Updated section content throughout for clarification.12) Updated the 5TS1 SOT23 and 8U3?1 VFBGA package drawings.13) Updated the PDIP, SOIC, TSSOP and UDFN package drawings to Microchip format.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 20 Aug 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
CCB 2953 Final Notice: Qualification of matte tin lead finish for selected Atmel products available PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSH Assembly site.Pre Change: Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compound material and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material, G700 molding compound material and NiPdAu lead finish.Post Change: Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compound material and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material, CEL-9240HF10AK molding compound material and Matte Tin lead finish.Reason for Change: To improve manufacturability by qualifying new bill of material for ASSH assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: May 27, 2018 (date code: 1821)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
CCB 2953 Final Notice: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSH Assembly site.PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSHASSEMBLY SITE:Pre Change:Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compoundmaterial and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material,G700 molding compound material and NiPdAu lead finish.Post Change:Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compoundmaterial and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material,CEL-9240HF10AK molding compound material and Matte Tin lead finishReason for Change: To improve manufacturability by qualifying new bill of material for ASSH assembly site.Change Implementation Status: In ProgressEstimated First Ship Date:May 27, 2018 (date code: 1821)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change:Traceability codeQualification Report:Please open the attachments included with this PCN labeled as PCN_#_Qual ReportRevision History:June 15, 2017:Issued initial notification.June 20, 2017: Re-issued initial notification to include affected parts list and qualification plan.June 23, 2017:Re-issued initial notification to correct a typo on molding compound material from CEL-9240HF10AK and G700A/G700LS to G700.July 13, 2017:Re-issued initial notification to include ANAP Assembly site in the post change.April 27, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on May 27, 2018.The change described in this PCN does not alter Microchip�s current regulatory complianceregarding the material content of the applicable products.
Cycle de vie du produit:
-
Conforme ROHS -
Sans plomb
Caractéristiques techniques
| Memory Density: | 16kb |
| Memory Organization: | 2 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount
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