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Référence fabricant
MCP6001T-E/OT
MCP6001 Series 6 V 1 MHz SMT Low-Power Operational Amplifier - SOT-23-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2529 | ||||||||||
Microchip MCP6001T-E/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 113195 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 26, 2025: Issued final notification. June 3, 2025: Re-issued final notification to include Backside Coat material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6001T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--amplifiers--general-purpose/mcp6001t-e-ot-microchip-1248020
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6001T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--amplifiers--general-purpose/mcp6001t-e-ot-microchip-1248020
Microchip MCP6001T-E/OT - Caractéristiques techniques
| Amplifier Type: | Low Power |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.6V/µs |
| Input Offset Voltage-Max: | 4.5mV |
| Gain Bandwidth Product: | 1MHz |
| Average Bias Current-Max: | 1100pA |
| Supply Voltage: | 1.8V to 6V |
| Common Mode Rejection Ratio: | 76dB |
| Supply Current: | 100µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 86dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 112dB |
| Phase Margin: | 90° |
| Low Noise: | 28nV/√Hz |
| Output Current: | 23mA |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This family operates from a single supply voltage as low as 1.8 V, while drawing 100 µA (typ.) quiescent current. Additionally, the MCP6001 supports rail-to-rail input and output swing, with a common mode input voltage range of VDD + 300 mV to VSS – 300 mV. This family of op amps is designed with Microchip’s
advanced CMOS process.
Features:
- Available in SC-70-5 and SOT-23-5 packages
- Gain Bandwidth Product: 1 MHz (typ.)
- Rail-to-Rail Input/Output
- Supply Voltage: 1.8 V to 5.5 V
- Supply Current: IQ = 100 µA (typ.)
- Phase Margin: 90° (typ.)
- Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
- Available in Single, Dual and Quad Packages
Applications:
- Automotive
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Notebooks and PDAs
- Battery-Powered Systems
View the complete family of MCP6001 product family
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount