
Manufacturer Part #
MCP6001T-E/OT
MCP6001 Series 6 V 1 MHz SMT Low-Power Operational Amplifier - SOT-23-5
Microchip MCP6001T-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP6001T-E/OT - Technical Attributes
Amplifier Type: | Low Power |
No of Channels: | 1 |
Slew Rate-Nom: | 0.6V/µs |
Input Offset Voltage-Max: | 4.5mV |
Gain Bandwidth Product: | 1MHz |
Average Bias Current-Max: | 1100pA |
Supply Voltage: | 1.8V to 6V |
Common Mode Rejection Ratio: | 76dB |
Supply Current: | 100µA |
Output Type: | Rail to Rail |
Power Supply Rejection Ratio: | 86dB |
Operating Temp Range: | -40°C to +125°C |
DC Voltage Gain: | 112dB |
Phase Margin: | 90° |
Low Noise: | 28nV/√Hz |
Output Current: | 23mA |
Package Style: | SOT-23-5 (SOT-25) |
Mounting Method: | Surface Mount |
Features & Applications
This family operates from a single supply voltage as low as 1.8 V, while drawing 100 μA (typ.) quiescent current. Additionally, the MCP6001 supports rail-to-rail input and output swing, with a common mode input voltage range of VDD + 300 mV to VSS – 300 mV. This family of op amps is designed with Microchip’s
advanced CMOS process.
Features:
- Available in SC-70-5 and SOT-23-5 packages
- Gain Bandwidth Product: 1 MHz (typ.)
- Rail-to-Rail Input/Output
- Supply Voltage: 1.8 V to 5.5 V
- Supply Current: IQ = 100 μA (typ.)
- Phase Margin: 90° (typ.)
- Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
- Available in Single, Dual and Quad Packages
Applications:
- Automotive
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Notebooks and PDAs
- Battery-Powered Systems
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount