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MCP6442-E/SN
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100 par Tube
SOIC-8
Surface Mount
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Product Category: 8-Bit Microcontrollers, Analog to Digital Converters, Digital Potentiometers, KEELOQ? Encoder Devices, Linear Comparators, Linear Op Amps, Linear Programmable Gain Amplifiers, Memory, Power Management - System Supervisors/Voltage DetectorsDescription of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound material for selected MCP130, MCP120, MCP60xx, MCP61xx, MCP65xx, MCP6Sxx, MCP62xx, MCP6Lxx, MCP41xx, MCP32xx, MCP30xx, MCP3301, MCP6Gxx, MCP64xx, 24LC0xx, 24LC64, 25LC640, 25AA640, 25LC320, 25C320, 25AA320, HCS101, 24C02C, PIC12xx, HCS201, and CN7032 device families available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve on-time delivery performance and manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound material.Estimated First Ship Date: 23 October 2026 (date code: 2643)
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
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