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Référence fabricant
MCP6541RT-E/OT
MCP6541 Series 5.5 V 1 pA Push-Pull Output Sub-Microamp Comparator - SOT-23
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2520 | ||||||||||
Microchip MCP6541RT-E/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 113195 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 26, 2025: Issued final notification. June 3, 2025: Re-issued final notification to include Backside Coat material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the MCP6541/1R/1U/2/3/4 Push-Pull Output Sub-Microamp Comparators Data Sheet of devices.Notification Status: FinalDescription of Change: Revision includes:1. Updated Section 5.1, Package Marking Information.2. Made minor formatting changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Oct 2022
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6541RT-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--comparators/mcp6541rt-e-ot-microchip-5010422
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6541RT-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--comparators/mcp6541rt-e-ot-microchip-5010422
Microchip MCP6541RT-E/OT - Caractéristiques techniques
| Type: | Sub-Microamp |
| No of Channels: | 1 |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.6V to 5.5V |
| Thermal Resistance: | 256°C/W |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP6541RT-E/OT is a Push-Pull Output Sub-Microamp Comparator, operates with a single-supply voltage as low as 1.6V and draws less than 1 μA/comparator of quiescent current.
Features:
- Low Quiescent Current: 600 nA/comparator (typ.)
- Rail-to-Rail Input: VSS - 0.3V to VDD + 0.3V
- CMOS/TTL-Compatible Output
- Propagation Delay: 4 μs (typ., 100 mV Overdrive)
- Wide Supply Voltage Range: 1.6V to 5.5V
- Low Switching Current
- Internal Hysteresis: 3.3 mV (typ.)
- Temperature Ranges:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Applications:
- Laptop Computers
- Mobile Phones
- Metering Systems
- Hand-held Electronics
- RC Timers
- Alarm and Monitoring Circuits
- Windowed Comparators
- Multi-vibrators
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount