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Référence fabricant
MCP3221A5T-I/OT
Single Channel I2C Interface 5.5 V 22.3 kbps 12-Bit A/D Converter - SOT-23-5
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| Nom du fabricant: | Microchip | ||||||||||
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Product Variant Information section
Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount |
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Microchip MCP3221A5T-I/OT - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 115274 ***Revision History: August 15, 2025: Issued initial notification. October 28, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be November 17, 2025. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 17 November 2025 (date code: 2547)
***UPDATE OF PCN113920***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 19 August 2025 (date code: 2534)
Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material. Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Following is the list of changes for this revision:? Added AEC-Q100 Qualification to Features and General Description.? Added Related Devices.? Updated the temperature range from industrial (-40?C to +85?C) to extended (-40?C to +125?C) in Section 1.0, "Electrical Specifications".? Updated Table 1-1, "DC Electrical Specifications" notes.? Updated Product Identification System.? Added Product Identification System (Automotive).Reason for Change: To improve productivity.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP3221A5T-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--data-converters--analog-to-digital-converter/mcp3221a5t-i-ot-microchip-3346244
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP3221A5T-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--data-converters--analog-to-digital-converter/mcp3221a5t-i-ot-microchip-3346244
Microchip MCP3221A5T-I/OT - Caractéristiques techniques
| Interface: | I2C |
| No of Channels: | 1 |
| Resolution: | 12b |
| Supply Voltage: | 2.7V to 5.5V |
| Sampling Rate: | 22.3kbps |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +150°C |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP3221A5T-I/OT is a part of MCP3221 Series Data Converters.It can sustain a operating temperature ranging from -40°C to 85°C, it is available in SOT-23-5 package.
The MCP3221 is a successive approximation A/D converter with 12-bit resolution, this device provides one single-ended input with very low power consumption. Based on an advanced CMOS technology, it provides a low maximum conversion current and standby current of 250 µA and 1 µA respectively.
Features:
- 12-bit resolution
- ±1 LSB DNL, ±2 LSB INL max
- 250 µA max conversion current
- 5 nA typical standby current, 1 µA max
- I2C™-compatible serial interface
- 100 kHz I2C Standard Mode
- 400 kHz I2C Fast Mode
- Up to 8 devices on a single 2-Wire bus
- 22.3 ksps in I2C Fast Mode
- Single-ended analog input channel
- On-chip sample and hold
- On-chip conversion clock
- Single-supply specified operation: 2.7 V to 5.5 V
- Temperature range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
- Small SOT-23-5 package
Applications:
- Data Logging
- Multi-zone Monitoring
- Hand-Held Portable Applications
- Battery-Powered Test Equipment
- Remote or Isolated Data Acquisition
View the complete product family of MCP3221 Series Data Converters
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount