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Référence fabricant
MCP1826ST-3302E/DB
1A CMOS LDO, VOUT=3.3V, EXTENDED TEMP RANGE
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :4000 par Reel Style d'emballage :SOT-223 (TO-261-4, SC-73) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2511 | ||||||||||
Microchip MCP1826ST-3302E/DB - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
PCN Status:Final NotificationDescription of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:July 20, 2024 (date code: 2429)
Description of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.
Statut du produit:
Microchip MCP1826ST-3302E/DB - Caractéristiques techniques
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 2.6V |
| Output Voltage Fixed: | 3.3V |
| Dropout Voltage-Max: | 400mV |
| Output Current-Max: | 1000mA |
| Style d'emballage : | SOT-223 (TO-261-4, SC-73) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
4000 par Reel
Style d'emballage :
SOT-223 (TO-261-4, SC-73)
Méthode de montage :
Surface Mount