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Manufacturer Part #
93LC56AT-I/OT
EEPROM IC 2Kbit Microwire 2 MHz SOT-23-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2535 | ||||||||||
Microchip 93LC56AT-I/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Microchip has released a new Datasheet for the 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet.Description of Change:Corrected ?1st Line Marking Codes? table.Reason for Change: To improve Productivity.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=93LC56AT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--micro-wire-interface-protocol/93lc56at-i-ot-microchip-1192030
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=93LC56AT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--micro-wire-interface-protocol/93lc56at-i-ot-microchip-1192030
Microchip 93LC56AT-I/OT - Technical Attributes
| Memory Density: | 2kb |
| Memory Organization: | 256 x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 2MHz |
| Write Cycle Time-Max (tWC): | 6ms |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Features & Applications
The 93LC56AT-I/OT is a 2 Kbit microwire compatible serial EEPROM; available in SOT-23-6 package.
This device provides dedicated 8-bit communication. The advanced CMOS technology makes this device ideal for low power, nonvolatile memory application.
Features:
- Low-Power CMOS Technology
- ORG Pin to Select Word Size for ‘56C’ Version
- 256 x 8-bit Organization ‘A’ Version (no ORG)
- Self-Timed Erase/Write Cycles (including Auto-Erase)
- Automatic Erase All (ERAL) before Write All (WRAL)
- Power-On/Off Data Protection Circuitry
- Industry Standard 3-Wire Serial I/O
- Device Status Signal (Ready/Busy)
- Sequential Read Function
- 1,000,000 Erase/write Cycles
- Data Retention > 200 Years
- Pb-free and RoHS Compliant
- Temperature Ranges Supported:
- Industrial (I) -40°C to +85°C
- Automotive (E) -40°C to +125°C
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount