Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
23LC1024-I/ST
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100 par Tube
TSSOP-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update of FPCN 119221 / Location and Material Change ***Revision History: January 09, 2024: Issued initial notification.February 25, 2026: Issued final notification. Added column "Change (Yes/No)" in the pre and post change table. Provided estimated first ship date to be on February 14, 2026. March 17, 2026: Re-issued final notification to attached the qualification report. Description of Change: Qualification of MMT as an additional assembly site for selected 23LC1024, 23A1024, 23LC512, 23A512, 23LCV1024, and 23LCV512 device families available in 8L TSSOP (4.4mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date: 14 February 2026 (date code: 2607)
***UPDATE OF FPCN103066***Revision History: January 09, 2024: Issued initial notification.February 25, 2026: Issued final notification. Added column "Change (Yes/No)" in the pre and post change table. Provided estimated first ship date to be on February 14, 2026. Description of Change: Qualification of MMT as an additional assembly site for selected 23LC1024, 23A1024, 23LC512, 23A512, 23LCV1024, and 23LCV512 device families available in 8L TSSOP (4.4mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date: 31 March 2026Estimated First Ship Date: 14 February 2026 (date code: 2607)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Qualification of MMT as an additional assembly site for selected 23LC1024, 23A1024, 23LC512, 23A512, 23LCV1024, and 23LCV512 device families available in 8L TSSOP (4.4mm) package.Reason for Change:Improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change: Updated section 3.6: Hold, Serial I/O 3 (HOLD/SIO3)Reason for Change: To Improve Productivity
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.