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Manufacturer Part #
DSPIC33EP512GM710-I/PF
dsPIC33EP Series 48kB RAM 512 kB Flash 16-Bit Digital Signal Controller-TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip DSPIC33EP512GM710-I/PF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Microchip has released a new Errata for the dsPIC33EPXXXGM3XX/6XX/7XX Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:1) Adds silicon issue 44. Module: ?I2C?.2) Add data sheet clarifications 24. Module: ?Electrical Characteristics?, 25. Module: ?Pin Diagrams?, 26. Module: ?Pin Diagram? and 27.Module: ?Special Features?.Reason for Change: To Improve Productivity
Part Status:
Microchip DSPIC33EP512GM710-I/PF - Technical Attributes
| Family Name: | dsPIC33EP |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 512kB |
| RAM Size: | 48kB |
| Speed: | 70MHz |
| No of I/O Lines: | 85 |
| InterfaceType / Connectivity: | CAN/IrDA/I2C/LIN/QEI/SPI/UART/USART |
| Peripherals: | Brown-out Detect/DMA/I2S/Motor Control PWM/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 9 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 49-chx10-bit / 49-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
90 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount