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PIC32CM6408JH00032-E/T5X
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250 par Tray
TQFP-32
Surface Mount
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Informations PCN:
Description of Change: Microchip has released a new Document for the PIC32CM32/64 JH00 Family Silicon Errata and Data Sheet Clarifications of devices.Added a note to the OSC48M Start-Up errataReason for Change: To Improve ProductivityDate Document Changes Effective: 07 Sep 2026
Product Category: 32-Bit MicrocontrollersNotification Subject: CCB 8369 Final Notice: Qualification of MTAI as an additional scan and pack site for selected ATSAMD21E16, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16L, ATSAMDA1E14B, ATSAMDA1E15B, ATSAMDA1E16B, ATSAMD20E16, PIC32CM1602GV00032, PIC32CM3204GV00032, ATSAMD20E14, ATSAMD20E15, ATSAMC21E15A, ATSAMC21E17A, ATSAMC21E18A, PIC32CM6408JH00032, PIC32CM3204JH00032, ATSAMC20E17A, ATSAMC20E18A, ATSAMC20E16A, ATSAMC21E16A, ATSAMC20E15A, ATSAMD21E17, ATSAMD21E18, ATSAMD20E18 and ATSAMD20E17 device families available in 32L TQFP (7x7x1mm) package.Description of Change: Qualification of MTAI as an additional scan and pack site for selected ATSAMD21E16, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16L, ATSAMDA1E14B, ATSAMDA1E15B, ATSAMDA1E16B, ATSAMD20E16, PIC32CM1602GV00032, PIC32CM3204GV00032, ATSAMD20E14, ATSAMD20E15, ATSAMC21E15A, ATSAMC21E17A, ATSAMC21E18A,Pre and Post Summary Changes:Pre ChangeMicrochip Technology Operations (Phils.) Corp.(MPHL)Post ChangeMicrochip Technology Operations (Phils.) Corp.(MPHL)Note: See attached SPCN document for more detailed descriptionReason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional scan and pack site.Change Implementation Status: In ProgressEstimated First Ship Date: 15 September 2026 (date code: 2638)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMC20E1xx, ATSAMC21E1xx, ATSAMD20E1xx, ATSAMD21E1xx, ATSAMDA1E1xx, ATSAML10E1xx, ATSAML11E1xx, ATSAML21E1xx, PIC32CM1216JH01032, PIC32CM1216MC00032, PIC32CM1602GV00032, PIC32CM2532JH00032, PIC32CM2532JH01032, PIC32CM3204GV00032, PIC32CM3204JH00032, PIC32CM6408JH00032 and PIC32CM6408MC00032 device families available in 32L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 13 October 2025 (date code: 2542)*Revision History: August 27, 2025: Issued final notification. The new die attach material was qualified via PCN #CENO-16EGCZ399 on July 22, 2025.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
