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AT90USB1287-AU
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90 par Tray
TQFP-64
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Cancellation of FPCN 118627 - Wire Material Change ***Revision History: January 21, 2026: Issued initial notification.March 27, 2026: Issued cancellation notification.Description of Change: This qualification was initially performed to qualify palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change: Microchip has decided not to qualify palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for AT90CAN128-16AU, AT90CAN128-16AUR, AT90USB1286-AU, AT90USB1286-AUR, AT90USB1287-AU, AT90USB1287-AUR, AT90USB646-AU, AT90USB646-AUR, AT90USB647-AU, AT90USB647-AUR, ATMEGA1280-16AU, ATMEGA1280-16AU-HCM, ATMEGA1280-16AUR, ATMEGA1280V-8AU, ATMEGA1280V-8AUR, ATMEGA1281-16AU, ATMEGA1281-16AUR, ATMEGA1281V-8AU, ATMEGA1281V-8AUR, ATMEGA2560-16AU, ATMEGA2560-16AU-HCM, ATMEGA2560-16AUR, ATMEGA2560V-8AU, ATMEGA2560V-8AUR, ATMEGA2561-16AU, ATMEGA2561-16AUR, ATMEGA2561V-8AU, ATMEGA2561V-8AUR, ATMEGA640-16AU, ATMEGA640-16AUR, ATMEGA640-16AURA0, ATMEGA640V-8AU and ATMEGA640V-8AUR catalog part numbers (CPN) available in 64L and 100L TQFP (14x14x1mm) package assembled at MMT site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material.Estimated First Ship Date: 26 May 2026 (date code: 2622)*Final Notification
Product Category: 8-Bit MicrocontrollersDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Estimated Qualification Completion Date: April 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Revision History:July 27, 2023: Issued initial notification.February 05, 2024: Updated affected parts list to remove CPN ATMEGA64L-8AQRA1 due to already EOL; Issued cancellation notification.Reason for Change:Microchip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire at MMT assembly site.Change Implementation Status:In Progress
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
