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Référence fabricant
ATMEGA1608-AFR
ATmega Series 16 kB Flash 2 kB RAM 20 MHz SMT 8-Bit Microcontroller - TQFP-32
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :200 par Style d'emballage :TQFP-32 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 1913 | ||||||||||
Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Product Documents for the ATmega808/809/1608/1609 Data Sheet of devices.Notification Status: FinalDescription of Change: Entire Document (SEE ATTACHED)Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 19 Mar 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the ATmega808/809/1608/1609 Silicon Errata and Data Sheet Clarification of devices.Description of Change:1) Device: 2.2.1 Writing the OSCLOCK Fuse in FUSE.OSCCFG to �1� Prevents Automatic Loading of Calibration Values2) CCL: 2.5.1 The CCL Must be Disabled to Change the Configuration of a Single LUT3) CRCSCAN: 2.6.1 The CRCSCAN Background Mode May Fail During an EEPROM or USERROW Write/Erase4) TCA: 2.7.1 Restart Will Reset Counter Direction in NORMAL and FRQ Mode5) TCB: 2.8.3 CCMP and CNT Registers Operate as 16-Bit Registers in 8-Bit PWM Mode6) USART:- 2.9.2 Open-Drain Mode Does Not Work When TXD is Configured as Output- 2.9.3 Start-of-Frame Detection Can Unintentionally Be Triggered in Active Mode Reason for Change: To Improve Productivity Date Document Changes Effective: 11 Feb 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the ATmega808/809/1608/1609 Data Sheet of devices.Notification Status: FinalDescription of Change: This revision includes the following changes - see attachedImpacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 22 Jun 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Description of Change: Qualification of MTAI as a new assembly site for selected Atmel products available in 32L (7x7x1.0mm) and 48L TQFP (7x7x1.0mm) package using gold (Au) wire.Pre Change: Assembled at ASCL assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, G700 and CEL-9240 molding compound, EN4900G die attach, and C194-ESH lead frame material with MSL Level 3 classification Post Change: Assembled at MTAI assembly site using gold (Au) bond wire, G700 molding compound, 3280 die attach, and C7025 lead frame material with MSL Level 1 classification Reason for Change:To improve productivity by qualifying MTAI as a new assembly siteEstimated First Ship Date:March 14, 2020 (date code: 2011)
Description of Change: 1) Entire document section changes:a. Change document structure from family and pin organized documents, to one document per data sheet:FROM:: - megaAVR 0-series Family Data Sheet - ATmega808/1608/3208/4808 - 28-pin Data Sheet- ATmega808/1608/3208/4808 - 32-pin Data Sheet - ATmega809/1609/3209/4809 - 48-pin Data Sheet TO: - ATmega808/809/1608/1609 Data Sheetb. Electrical Characteristics section changes: - Minimum and maximum values added- Editorial updatesc.Typical Characteristics section changes:- Added more graphs to the Power Consumption section.Reason for Change: To Improve ProductivityDate Document Changes Effective: 6 Feb 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Notification subject: ERRATA - ATmega808/809/1608/1609 Silicon Errata and Data Sheet ClarificationNotification Status: FinalDescription of Change: 1) Change document structure from one document for the entire megaAVR 0-series to one document per data sheet. 2) Updated document template 3) The ADC errata, ADC Functionality Cannot be Ensured with ADCCLK Above 1.5 MHz for All Conditions, has been split into two separate erratas and rewritten.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 Feb 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Description of Change:Qualification of MTAI as an additional assembly site for selected Atmel products available in 32L (7x7x1.0mm) and 48L TQFP (7x7x1.0mm) package using gold (Au) wire.Pre Change:Assembled at ASCL assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, EN4900G die attach, and C194-ESH lead frame material with MSL Level 3 classificationPost Change:Assembled at ASCL assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, EN4900G die attach, and C194-ESH lead frame material with MSL Level 3 classification Assembled at MTAI assembly site using gold (Au) bond wire, 3280 die attach, and C7025 lead frame material with MSL Level 1 classification.Reason for Change:To improve productivity by qualifying MTAI as an additional assembly site
Final Notice: Implement top marking changes for selected ATMEGA480x, ATMEGA320x, ATMEGA160x, ATMEGA80x Atmel device families manufactured with 59.91k process technologyPre Change: With package code, temperature grade, packing media and die rev in the top markingPost Change: Without package code, temperature grade, packing media and die rev in the top markingReason for Change:To improve manufacturability and on time delivery by standardizing top marking format for ATMEGA480x, ATMEGA320x, ATMEGA160x, ATMEGA80x device familiesPlease be advised that after the estimated first ship date customers may receive pre and post change parts
Description of Change:1) Entire Document: Editorial Updates.2) Features: Added industrial temperature range -40degC to +85degC3) Pinout: Added note about QFN center pad attachment4) Ordering Information: a) Added table of available product numbers b) Updated Product Information System figure5) Package Drawings: Updated TQFP package drawingReason for Change: To Improve ManufacturabilityDate Document Changes Effective: 23 Aug 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change: 1) Entire document chapter: Editorial updates2) Feature chapter: Added industrial temperature range -40�C to +85�C3) 2 megaAVR 0-series Overview chapter: megaAVR 0-series Overview. Added ordering code for industrial temperature range in megaAVR Device Designations figure.4) 5.8 Fuses (FUSE) chapter: Added default fuse valuesReason for Change: To Improve ManufacturabilityPlease be advised that this is a change to the document only the product has not been changed
Statut du produit:
Caractéristiques techniques
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 2kB |
| Speed: | 20MHz |
| No of I/O Lines: | 27 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/Reset |
| Number Of Timers: | 4 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 12-chx10-bit |
| Style d'emballage : | TQFP-32 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
200 par
Style d'emballage :
TQFP-32
Méthode de montage :
Surface Mount
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