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Manufacturer Part #
MCP6H02T-E/MNY
MCP6H02 Series 16 V 1.2 MHz Single Supply CMOS Operational Amplifier - TDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6H02T-E/MNY - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Initial NotificationDescription of Change:Qualification of MMT as an additional assembly site for selected MCP16311, MCP16312, MCP16331, MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP6H01, MCP6H02, MCP6H71, MCP6H72, MCP6H91and MCP6H92 device families available in 8L TDFN (2x3x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6H02T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--amplifiers--general-purpose/mcp6h02t-e-mny-microchip-1075997
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6H02T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--amplifiers--general-purpose/mcp6h02t-e-mny-microchip-1075997
Microchip MCP6H02T-E/MNY - Technical Attributes
| No of Channels: | 2 |
| Slew Rate-Nom: | 0.8V/µs |
| Input Offset Voltage-Max: | 3.5mV |
| Package Style: | TDFN-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6H02 family of operational amplifiers (op amps) has a wide supply voltage range of 3.5 V to 16 V and rail-to-rail output operation. This family is unity gain stable and has a gain bandwidth product of 1.2 MHz (typical). These devices operate with a single-supply voltage as high as 16V, while only drawing 135 μA/amplifier (typical) of quiescent current.
Features:
- Input Offset Voltage: ±0.7 mV (typical)
- Quiescent Current: 135 μA (typical)
- Common Mode Rejection Ratio: 100 dB (typical)
- Power Supply Rejection Ratio: 102 dB (typical)
- Rail-to-Rail Output
- Supply Voltage Range:
- Single-Supply Operation: 3.5 V to 16 V
- Dual-Supply Operation: ±1.75 V to ±8 V
- Gain Bandwidth Product: 1.2 MHz (typical)
- Slew Rate: 0.8 V/μs (typical)
- Unity Gain Stable
- Extended Temperature Range: -40°C to +125°C
- No Phase Reversal
Applications:
- Automotive Power Electronics
- Industrial Control Equipment
- Battery Powered Systems
- Medical Diagnostic Instruments
Available Packaging
Package Qty:
3300 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount