Manufacturer Part #
MCP6S21-I/SN
MCP6S21 Series 5.5 V 12 MHz Single-Ended Rail-to-Rail I/O Low Gain PGA - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2404 | ||||||||||
Microchip MCP6S21-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
Microchip MCP6S21-I/SN - Technical Attributes
| Amplifier Type: | Programmable Gain |
| No of Channels: | 1 |
| 3dB Bandwidth-Min: | 12MHz |
| Slew Rate-Nom: | 4V/µs |
| Input Offset Voltage-Max: | 275µV |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 2.5V to 5.5V |
| Supply Current: | 1mA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 85dB |
| Operating Temp Range: | -40°C to +125°C |
| Low Noise: | 10nV/√Hz |
| Output Current: | 30mA |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6S21 series of analog Programmable Gain Amplifiers (PGA). They can be configured for gains from +1 V/V to +32 V/V and the input multiplexer can select one of up to eight channels through an SPI port. The serial interface can also put the PGA into shutdown to conserve power. These PGAs are optimized for high speed, low offset voltage and single-supply operation with rail-to-rail input and output capability. These specifications support single supply applications needing flexible performance or multiple inputs.
The one channel MCP6S21 and the two channel MCP6S22 are available in 8-pin PDIP, SOIC and MSOP packages. The six channel MCP6S26 is available in 14-pin PDIP, SOIC and TSSOP packages. The eight channel MCP6S28 is available in 16-pin PDIP and SOIC packages. All parts are fully specified from -40°C to +85°C.
Features:
- Multiplexed Inputs: 1, 2, 6 or 8 channels
- 8 Gain Selections:
- +1, +2, +4, +5, +8, +10, +16 or +32 V/V
- Serial Peripheral Interface (SPI™)
- Rail-to-Rail Input and Output
- Low Gain Error: ±1% (max)
- Low Offset: ±275 μV (max)
- High Bandwidth: 2 to 12 MHz (typ)
- Low Noise: 10 nV/√Hz @ 10 kHz (typ)
- Low Supply Current: 1.0 mA (typ)
- Single Supply: 2.5 V to 5.5 V
Applications:
- A/D Converter Driver
- Multiplexed Analog Applications
- Data Acquisition
- Industrial Instrumentation
- Test Equipment
- Medical Instrumentation
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount