Manufacturer Part #
TC1411NCPA
TC1411 Series 1 A 16 Vmax Low Side Non-Inverting MOSFET Driver - PDIP-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Tube Package Style:PDIP-8 Mounting Method:Through Hole | ||||||||||
| Date Code: | 2302 | ||||||||||
Microchip TC1411NCPA - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
Microchip TC1411NCPA - Technical Attributes
| Configuration: | Low Side |
| No of Outputs: | Single |
| Output Impedance: | 8Ω |
| Peak Output Current: | 1A |
| Supply Voltage-Max: | 16V |
| Package Style: | PDIP-8 |
| Mounting Method: | Through Hole |
Features & Applications
Features:
- Latch-Up Protected: Will Withstand 500 mA Reverse Current
- Input Will Withstand Negative Inputs Up to 5 V
- ESD Protected: 4 kV
- High Peak Output Current: 1 A
- Wide Input Supply Voltage Operating Range:
- 4.5 V to 16 V
- High Capacitive Load Drive Capability:
- 1000 pF in 25 nsec
- Short Delay Time: 30 nsec Typ.
- Consistent Delay Times With Changes in Supply Voltage
- Matched Delay Times
- Low Supply Current
- With Logic 1 Input: 500 µA
- With Logic 0 Input: 100 µA
- Low Output Impedance: 8Ω
- Available in Space-Saving 8-pin MSOP Package
Applications:
- Switch Mode Power Supplies
- Line Drivers
- Pulse Transformer Drive
- Relay Driver
Available Packaging
Package Qty:
60 per Tube
Package Style:
PDIP-8
Mounting Method:
Through Hole