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Manufacturer Part #
MIC2026-1YM
MIC2026 Series 5.5 V 140 mOhm Dual-Channel High Side MosFet Switch - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:95 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount |
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| Date Code: | 2240 | ||||||||||
Microchip MIC2026-1YM - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Microchip has released a new Datasheet for the MIC2026 Family Data Sheet of devices.Description of Change:?Updated Section ?Features?.?Updated ESD Ratings in Section ?Electrical Characteristics?.?Updated Package Drawing in Section 6.0 ?Packaging Information?.Reason for Change: To improve productivity.
Part Status:
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Microchip MIC2026-1YM - Technical Attributes
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
95 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount