
Référence fabricant
MCP1700T-3302E/TT
250MA CMOS LDO, ISUPPLY 1UA AND 2% VOUT ACCURACY
Microchip MCP1700T-3302E/TT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23(1.3mm) package.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Statut du produit:
Microchip MCP1700T-3302E/TT - Caractéristiques techniques
Input Voltage-Min: | 2.3V |
Input Voltage-Max: | 6V |
Output Voltage Fixed: | 3.3V |
Dropout Voltage-Max: | 350mV |
Output Current-Max: | 250mA |
Rated Power: | 369.6mW |
Tolerance (%): | ±0.4% |
Operating Temp Range: | -40°C to +125°C |
Regulator Topology: | Fixed |
Quiescent Current: | 4µA |
No. of Outputs: | Single |
Output Noise: | 3µV |
Load Regulation (%): | 1.5% |
Line Regulation (%): | 1% |
Style d'emballage : | SOT-23 (SC-59,TO-236) |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23 (SC-59,TO-236)
Méthode de montage :
Surface Mount