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Manufacturer Part #
MIC5504-3.3YMT-TZ
SINGLE 300MA LDO WITH ENABLE PULL-DOWN & AUTO DISCHARGE
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:10000 per Reel Package Style:TDFN-4 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC5504-3.3YMT-TZ - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN115456***Revision History: August 22, 2025: Issued initial notification. August 26, 2025: Re-issued initial notification to update qualification plan. Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5501, MIC5502, MIC5503, MIC5504, MIC5524 and MIC5528 device families available in 4L UDFN (1.0x1.0x0.6mm) and 6L UDFN (1.2x1.2x0.6mm) packages.Reason for Change: To improve on time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: January 2026
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5501, MIC5502, MIC5503, MIC5504, MIC5524 and MIC5528 device families available in 4L UDFN (1.0x1.0x0.6mm) and 6L UDFN (1.2x1.2x0.6mm) packages.Reason for Change: To improve on time delivery performance by qualifying ATP7 as an additional assembly site.
***UPDATE OF PCN112765***Description:Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Revision History: May 07, 2025: Issued initial notification.June 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 28, 2025.
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Microchip has released a new Datasheet for the MIC5501/2/3/4 - 300mA Single Output LDO in Small Packages of devices. Notification Status: FinalDescription of Change:? Replaced the TDFN package type with UDFN throughout the document.? Updated the package drawings within Section 7.0 ?Packaging Information?.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 27 Mar 2024
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5504-3.3YMT-TZ&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--regulators-reference--linear-regulators/mic5504-3-3ymt-tz-microchip-7081130
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5504-3.3YMT-TZ&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--regulators-reference--linear-regulators/mic5504-3-3ymt-tz-microchip-7081130
Microchip MIC5504-3.3YMT-TZ - Technical Attributes
| Package Style: | TDFN-4 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
10000 per Reel
Package Style:
TDFN-4
Mounting Method:
Surface Mount