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Manufacturer Part #
TCM809LENB713
TCM809 Series 4.63 V 140 ms 3-Pin Microcontroller Reset Monitor - SOT23B-3
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23B-3 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2526 | ||||||||||
Microchip TCM809LENB713 - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 116914 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.November 3, 2025: Re-issued final notification to update affected parts list to add MCP9700T H/TTVAO-VW catalog part number. Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 116870 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT-I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
** *UPDATE OF PCN111024 & PCN113243***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 28 November 2025 (date code: 2548)
***UPDATE OF PCN114280***Revision History: May 28, 2025: Issued initial notification. July 7, 2025: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.July 14, 2025: Re-issued final notification to update the year of Final Issuance date.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.
*** Update for PCN 113228 ***Revision History: May 28, 2025: Issued initial notification. July 7, 2024: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 24 July 2025 (date code: 2530)
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23(1.3mm) package.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=TCM809LENB713&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--system-management--voltage-supervisors/tcm809lenb713-microchip-4754552
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=TCM809LENB713&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--system-management--voltage-supervisors/tcm809lenb713-microchip-4754552
Microchip TCM809LENB713 - Technical Attributes
| No of Outputs: | Single |
| Threshold Voltage: | 4.63|V |
| Supply Voltage-Max: | 5.5V |
| Reset Timeout: | 140ms |
| Package Style: | SOT-23B-3 |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V Nominal System Voltage Supplies
- 140 msec Minimum RESET Time Out Period
- RESET Output to VDD = 1.0V (TCM809)
- Low Supply Current, 9 μA (typ.)
- VDD Transient Immunity
- Small 3-Pin SC-70 and SOT-23B Packages
- No External Components
- Push-Pull RESET Output
- Temperature Range:
- Industrial, SC-70 (E): -40°C to +85°C
- Extended, SOT-23, SC-70 (V): -40°C to +125°C
Applications:
- Computers
- Embedded Systems
- Battery-Powered Equipment
- Critical Microcontroller Power Supply Monitoring
- Automotive
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23B-3
Mounting Method:
Surface Mount