Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Référence fabricant
TCM810LVNB713
TCM810 Series 4.63 V 140 ms 3-Pin Microcontroller Reset Monitor - SOT23B-3
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23B-3 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip TCM810LVNB713 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 116914 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.November 3, 2025: Re-issued final notification to update affected parts list to add MCP9700T H/TTVAO-VW catalog part number. Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 116870 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT-I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
** *UPDATE OF PCN111024 & PCN113243***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 28 November 2025 (date code: 2548)
***UPDATE OF PCN114280***Revision History: May 28, 2025: Issued initial notification. July 7, 2025: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.July 14, 2025: Re-issued final notification to update the year of Final Issuance date.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.
*** Update for PCN 113228 ***Revision History: May 28, 2025: Issued initial notification. July 7, 2024: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 24 July 2025 (date code: 2530)
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23(1.3mm) package.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TCM810LVNB713&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--system-management--voltage-supervisors/tcm810lvnb713-microchip-7199201
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TCM810LVNB713&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--analog--system-management--voltage-supervisors/tcm810lvnb713-microchip-7199201
Microchip TCM810LVNB713 - Caractéristiques techniques
| No of Outputs: | Single |
| Threshold Voltage: | 4.63|V |
| Supply Voltage-Max: | 5.5V |
| Reset Timeout: | 140ms |
| Style d'emballage : | SOT-23B-3 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23B-3
Méthode de montage :
Surface Mount