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Manufacturer Part #
APT2X31D40J
APT2X31D40J Series 400 V 30 A Ultrafast Soft Recovery Rectifier Diode - ISOTOP®
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Tube Package Style:SOT-227 Mounting Method:Chassis Mount | ||||||||||
| Date Code: | |||||||||||
Microchip APT2X31D40J - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of MCSO as an additional fabrication site for selected FRED 600V, FRED-400V, FRED-300V, FRED-200V, FRED-1200V and FRED-1000V device families available in various packages.Reason for Change: To improve productivity by qualifying MCSO as an additional fabrication site.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT2X31D40J&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--discretes--diodes--ultrafast-rectifiers/apt2x31d40j-microchip-5074242
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT2X31D40J&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--discretes--diodes--ultrafast-rectifiers/apt2x31d40j-microchip-5074242
Microchip APT2X31D40J - Technical Attributes
| Average Rectified Current-Max: | 30A |
| Peak Current-Max: | 320A |
| Reverse Voltage-Max [Vrrm]: | 400V |
| Reverse Current-Max: | 250µA |
| Forward Voltage: | 1.3V |
| Configuration: | Dual |
| Forward RMS Current [If rms]: | 49A |
| Diode Capacitance-Max: | 60pF |
| Reverse Recovery Time-Max: | 22ns |
| Thermal Resistance: | 20°C/W |
| Operating Temp Range: | -55°C to +175°C |
| Storage Temperature Range: | -55°C to +175°C |
| Package Style: | SOT-227 |
| Mounting Method: | Chassis Mount |
Available Packaging
Package Qty:
1 per Tube
Package Style:
SOT-227
Mounting Method:
Chassis Mount