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Manufacturer Part #
DSEE29-12CC
DSEE Series 1200 Vrrm 30 A 1.75 Vf Epitaxial Diode - ISOPLUS-220
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| Mfr. Name: | Littelfuse - IXYS | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:50 per Tube Package Style:ISOPLUS-220 Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Littelfuse - IXYS DSEE29-12CC - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Form, fit, function changes : No changeEffective date : Jan 2, 2026
Description of Change:Littelfuse wants to inform you that we have an alternative Backend AssemblySite for our Diode ISOPLUS220 & ISOPLUS264 Package Products that islocated in our new in-house factory in Lipa, Philippines.1) Silicon Die: No change2) Backend Assembly Bill of Materials: No change3) Backend Assembly Process Flow: No change4) Backend Assembly Equipment: Equal or better5) Marking & Labeling: Yes. (refer to PCN letter)Product form, fit, function changes: NonePart number changes: None
ISOPLUS220 New Leadframe Tooling Supplier.Littelfuse wants to inform you that we have qualified a New Leadframe Tooling Supplier for ISOPLUS220 Package Products to address delivery issues due to Leadframe shortage. The selected supplier is strategically located near the ISOPLUS220 Assembly Site and is an existing supplier for other Power Semi packages of Littelfuse. Our target is to establish businesscontinuity and provide seamless support for ISOPLUS220 Package Products meeting the highest quality standards.Below are the detailed changes associated with ISOPLUS220 New Leadframe Tooling Supplier:1) Leadframe Supplier : Please refer to below details.2) Leadframe Material : No change3) Dimensional Changes : No change
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSEE29-12CC&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/en/it/p/semiconductors--discretes--diodes--ultrafast-rectifiers/dsee29-12cc-littelfuse-ixys-3036506
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSEE29-12CC&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/en/it/p/semiconductors--discretes--diodes--ultrafast-rectifiers/dsee29-12cc-littelfuse-ixys-3036506
Littelfuse - IXYS DSEE29-12CC - Technical Attributes
| Average Rectified Current-Max: | 30A |
| Peak Current-Max: | 200A |
| Reverse Voltage-Max [Vrrm]: | 1200V |
| Reverse Current-Max: | 200µA |
| Forward Voltage: | 1.75V |
| Configuration: | Dual |
| Forward RMS Current [If rms]: | 35A |
| Diode Capacitance-Max: | 26pF |
| Reverse Recovery Time-Max: | 30ns |
| Operating Temp Range: | -55°C to +150°C |
| Storage Temperature Range: | -55°C to +150°C |
| Package Style: | ISOPLUS-220 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
50 per Tube
Package Style:
ISOPLUS-220
Mounting Method:
Through Hole