Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
SY89468UHY
1:20 LVDS FANOUT W/ 2:1 FSI INPUT MUX
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-64EP Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SY89468UHY - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
***FPCN106550 UPDATE***Revision History:July 19, 2024: Issued initial notification.January 23, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 15, 2025.Description of Change:Qualification of MTAI as an additional assembly site for selected SY89467U, SY89825U, SY89221U, SY89826L, SY89828L, SY89824L, SY89468U and SY89218U device families available in 64L TQFP (10x10x1.0mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as additional assembly site.
Description of Change:Qualification of MTAI as an additional assembly site for selected SY89467U, SY89825U, SY89221U, SY89826L, SY89828L, SY89824L, SY89468U and SY89218U device families available in 64L TQFP (10x10x1.0mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as additional assembly site.
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SY89468UHY&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--logic--timing-solutions--clocks/sy89468uhy-microchip-6953004
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SY89468UHY&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--logic--timing-solutions--clocks/sy89468uhy-microchip-6953004
Microchip SY89468UHY - Technical Attributes
| Type: | Differential |
| Clock Output Frequency - Max: | 1.5GHz |
| Supply Voltage-Nom: | 2.5V |
| Package Style: | TQFP-64EP |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64EP
Mounting Method:
Surface Mount