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Manufacturer Part #
AT24CM02-SSHD-B
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100 per Tube
SOIC-8
Surface Mount
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COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Microchip has released a new Datasheet for the AT24CM02 - 2-Mbit I?C Serial EEPROM of devices.Description of Change:Replaced Atmel WLCSP drawing with Microchip version (no change to form, fit or function). Corrected embedded addressing bits in waveforms. Removed typical DC Characteristics parameters.Reason for Change: To improve productivity.
Revision History:May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.January 30, 2024: Re-issued final notification to update Pre and Post Change Summary.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 26, 2024 (date code: 2404)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:\May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.
Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Reason for Change:To improve productivity by qualifying MTAI as an additional assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.