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Manufacturer Part #
ATSAMD21G17L-MUT
IC MCU 32BIT 128KB FLASH 48QFN
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:4000 per Package Style:QFN-48 Mounting Method:Surface Mount |
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| Date Code: | 1852 | ||||||||||
Microchip ATSAMD21G17L-MUT - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 111567 ***Revision History: March 12, 2025: Issued initial notification.February 04, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on May 07, 2026. Updated the notification subject. Revised affected parts list to add automotive part numbers. Description of Change: Qualification of UMC Fab 8S (U08S) an additional fabrication site for selected ATMPS001D14A, ATSAMD09C1x, ATSAMD09Dxx, ATSAMD10C1x, ATSAMD10D1x, ATSAMD11C14, ATSAMD11D14, ATSAMD20E1x, ATSAMD20G1x, ATSAMD20J1x, ATSAMD21E1x, ATSAMD21G1x, ATSAMD21J1x, ATSAMDA1E1x, ATSAMDA1G1x, ATSAMDA1J1x, ATSAML10D1xx, ATSAML10E1xx, ATSAML11D1xx, ATSAML11E1xx, ATSAML21E1xx, ATSAML21G1xx, ATSAML21J1xx, ATSAML22G1xx, ATSAML22J1xx, ATSAML22N1xx, PD39210, PD69210, PD69220, PD77010, PD77020, PIC32CM1602GV000xx, PIC32CM2532LE000xx, PIC32CM2532LS000xx, PIC32CM3204GV000xx, PIC32CM5164LE000xx, PIC32CM5164LS000xx, PIC32CM2532LE00100, PIC32CM2532LS00100, PIC32CM5164LE00100 and PIC32CM5164LS00100 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying UMC Fab 8S (U08S) as an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: 07 May 2026 (date code: 2619)
*** Update for PCN 113133 ***Revision History: May 16, 2025: Issued initial notification.October 12, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date is to be on October 31, 2025. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, ATSAMC21G15A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC21G18A, ATSAMD20G14, ATSAMD20G15, ATSAMD20G16, ATSAMD20G17, ATSAMD20G18, ATSAMD21G15, ATSAMD21G16x, ATSAMD21G17x, ATSAMD21G18, ATSAML21G16B, ATSAML21G17B and ATSAML21G18B device families available in 48L VQFN (7x7x0.9mm) package at MP3A assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 31 October 2025 (date code: 2544)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
****FPCN115312/FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMD21xx, ATSAMC21xx, ATSAMC20xx, ATSAMDA1xx, ATSAMD20xx, ATSAML22xx, ATSAML21xx, PIC32CM2xx, PIC32CM1xx, PIC32CM3xx, PIC32CM6xx, ATSAML10xx,ATSAML11xx and PIC32CM5xx device families available in 32L and 48L VQFN (5x5x1mm and 7x7x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, ATSAMC21G15A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC21G18A, ATSAMD20G14, ATSAMD20G15, ATSAMD20G16, ATSAMD20G17, ATSAMD20G18, ATSAMD21G15, ATSAMD21G16x, ATSAMD21G17x, ATSAMD21G18, ATSAML21G16B, ATSAML21G17B and ATSAML21G18B device families available in 48L VQFN (7x7x0.9mm) package at MP3A assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: June 2025
Description of Change: Qualification of UMC Fab 8S (U08S) an additional fabrication site for selected ATSAMD21E17, ATSAMD21E17LATSAMD21G17, ATSAMD21G17L, ATSAMD21J17, ATSAMD21J17D, PD39210, PD69210, PD69220 and PD77020 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying UMC Fab 8S (U08S) as an additional fabrication site.
Part Status:
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Microchip ATSAMD21G17L-MUT - Technical Attributes
| Family Name: | QFN-48 |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 16kB |
| Speed: | 48MHz |
| No of I/O Lines: | 38 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART |
| Peripherals: | Brownout Reset/Brown-out Detect/DMA/I2S/POR |
| Supply Voltage: | 1.62V to 3.63V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 14-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Package Style: | QFN-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
4000 per
Package Style:
QFN-48
Mounting Method:
Surface Mount