
Manufacturer Part #
ATMEGA168V-10AU
ATmega Series 16 KB Flash 1 KB SRAM 10 MHz 8-Bit Microcontroller - TQFP-32
Microchip ATMEGA168V-10AU - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MPHL as a new final test site for selected ATMEGA48xx, ATMEGA88xx and ATMEGA168xx device families available in 32L TQFP (7x7x1mm) package.Reason for Change:To improve manufacturability by qualifying MPHL as a new final test site. Estimated Qualification Completion Date:March 2022
Part Status:
Microchip ATMEGA168V-10AU - Technical Attributes
Family Name: | ATmega |
Core Processor: | AVR |
Program Memory Type: | Flash |
Flash Size (Bytes): | 16kB |
RAM Size: | 1kB |
Speed: | 10MHz |
No of I/O Lines: | 23 |
InterfaceType / Connectivity: | I2C/SPI/UART/USART |
Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
Supply Voltage: | 1.8V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 8-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-32 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
250 per Tray
Package Style:
TQFP-32
Mounting Method:
Surface Mount