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Manufacturer Part #
ATTINY1624-SSU
8-bit MCU, 20MHz, 16KB, Ind 85C, Green14 in a 14 pin SOIC pkg
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:57 per Tube Package Style:SOIC-14 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATTINY1624-SSU - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Microchip has released a new Document for the ATtiny1624/1626/1627 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change:? Document:? Editorial updates? Added new errata:? Device: 2.2.2. Writing the OSCLOCK Fuse in FUSE.OSCCFG to ?1? Prevents Automatic Loading ofCalibration Values? NVMCTRL: 2.5.1. Wrong Reset Value of NVMCTRL.CTRLA Register? USART: 2.8.3. Receiver Non-Functional after Detection of Inconsistent Synchronization Field? Added new data sheet clarifications:? I/O Multiplexing and Considerations:? 3.1.1. I/O Multiplexing? Electrical Characteristics:? 3.2.1. I/O Pin Characteristics? 3.2.2. SPI - Timing Characteristics? 3.2.3. Programming TimeImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 June 2024
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Part Status:
Microchip ATTINY1624-SSU - Technical Attributes
| Family Name: | ATtiny |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 2kB |
| Speed: | 20MHz |
| No of I/O Lines: | 12 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 9-chx12-bit |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
57 per Tube
Package Style:
SOIC-14
Mounting Method:
Surface Mount