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Manufacturer Part #
AVR64DA32-I/PT
64KB, 8KB RAM, 32p, 24MHz, 12b ADC, 3xComp, PTC, 3xZCD, DAC, 6xUART, 2xSPI, TWI
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:250 per Tray Package Style:TQFP-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip AVR64DA32-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:? Added new device revision (A6)? Added errata:? Device: Write Operation Lost if Consecutive Writes to Specific Address Spaces? ADC: ADC MUX Selection and Accumulation Number has Delayed Update When Initialization Delay is Used? NVMCTRL: NVM_EEPROM_ERASE Command does Not Respect Write Protect? TCB: TCB4 Waveform Output Alternative 1 Non-Functional? USART: Receiver Non-Functional after Detection of Inconsistent Synchronization Field?? Removed data sheet clarifications:? 3.1. Features? 3.2. FUSE - Configuration and User Fuses?3.3. RSTCTRL - Reset Controller? 3.4. TWI - Two-Wire Interface? 3.5. Electrical Characteristics- Peripheral Power Consumption? 3.6. Electrical Characteristics - Memory Programming Specifications? 3.7. Electrical Characteristics VREF? 3.8. Electrical Characteristics - DAC? 3.9.Electrical Characteristics - ADCReason for Change: To Improve Productivity
Part Status:
Microchip AVR64DA32-I/PT - Technical Attributes
| Family Name: | AVR64 |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 8kB |
| Speed: | 24MHz |
| No of I/O Lines: | 27 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 14-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Package Style: | TQFP-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
250 per Tray
Package Style:
TQFP-32
Mounting Method:
Surface Mount