
Référence fabricant
PIC16F1847-I/SO
PIC16F Series 14 kB Flash 1 kB RAM 32 MHz 8-Bit Microcontroller - SOIC-18
Microchip PIC16F1847-I/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Final Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC packageDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC packageDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
Microchip PIC16F1847-I/SO - Caractéristiques techniques
Family Name: | PIC16F |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 14kB |
RAM Size: | 1kB |
Speed: | 32MHz |
No of I/O Lines: | 15 |
InterfaceType / Connectivity: | I2C/SPI/USART |
Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
Number Of Timers: | 5 |
Supply Voltage: | 1.8V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 12-chx10-bit |
Watchdog Timers: | 1 |
Style d'emballage : | SOIC-18 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
42 par Tube
Style d'emballage :
SOIC-18
Méthode de montage :
Surface Mount