
Manufacturer Part #
PIC24HJ256GP610-I/PF
PIC24 Series 16 kB RAM 256 kB Flash 16-Bit Microcontroller - TQFP-100
Microchip PIC24HJ256GP610-I/PF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:August 10, 2023: Issued initial notification.June 05, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 23, 2025. Updated the notification subject and description change.Note: The change described in this PCN does not alter Microchip's current regulatory compliance regarding the material content of the applicable product.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected dsPIC33FJ6xx, PIC18F96J6xx, PIC18F97J6xx, PIC24FJ64Gxx, PIC24FJ128xx, PIC24FJ192xx, PIC24FJ256xx, PIC24FJ96Gxx, dsPIC33FJ2xx, PIC24HJ64Gxx, dsPIC33FJ1xx, PIC24HJ128xx, PIC24HJ256xx and dsPIC33FJ3xx device families available in 64L and 100L TQFP (14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire asnew wire material for selected DSPIC33FJ128xxx, DSPIC33FJ256xxx, DSPIC33FJxxGSxxx,DSPIC33FJxxMxxx, PIC18F9xJxx and PIC24FJxxxGxxx device families available in 64L and 100L TQFP(14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with goldflash (CuPdAu) bond wire.
Part Status:
Microchip PIC24HJ256GP610-I/PF - Technical Attributes
Family Name: | PIC24H |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 256kB |
RAM Size: | 16kB |
Speed: | 40MHz |
No of I/O Lines: | 85 |
InterfaceType / Connectivity: | CAN/I2C/SPI/UART |
Peripherals: | CAN/I2C/On-Chip-ADC/PWM/SPI/UART/Watchdog |
Number Of Timers: | 9 |
Supply Voltage: | 3V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 2(32-chx12-bit) |
Watchdog Timers: | 1 |
Package Style: | TQFP-100 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
90 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount