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Manufacturer Part #
MCP6N11T-010E/SN
SINGLE, INSTRUMENTATION AMP, MCAL, E TEMP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6N11T-010E/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Revision History:February 9, 2021: Issued final notification. Provided estimated first ship date to be February 19, 2021.March 22, 2021: Re-issued final notification. Attached the qualification report.Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designChange Implementation Status:In ProgressEstimated First Ship Date:February 19, 2021 (date code: 2108)
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame design.Estimated Qualification Completion Date:March 2021
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designEstimated First Ship Date: February 19, 2021 (date code: 2108)
Part Status:
Microchip MCP6N11T-010E/SN - Technical Attributes
| No of Channels: | 1 |
| Slew Rate-Nom: | 9V/ns |
| Input Offset Voltage-Max: | 0.5mV |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount