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Manufacturer Part #
RMLV1616AGBG-5S2#AC0
SRAM Memory IC 16Mb (1M x 16) Parallel 55ns 48-TFBGA (7.5x8.5)
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| Mfr. Name: | Renesas | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:253 per Tray Package Style:TFBGA-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2511 | ||||||||||
Renesas RMLV1616AGBG-5S2#AC0 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Regarding the assembly site for Low Power SRAM 48-ball FBGA products, Renesas changes the site from Amkor Technology Japan, Inc. Kumamoto (hereinafter referred as ATJ-Kumamoto) to Greatek Electronics Inc. (hereinafter referred as GTK). The assembly materials of GTK products use GTK?s standard materials. Regarding the comparison table between ATJ-Kumamoto products and GTK products, please refer attachment.Reason for Change: To serve the objective of stable supply against the obsolescence of manufacturing equipment.Effective Date: 5/6/2025
Description of Change: Regarding the assembly site for Low Power SRAM 48-ball FBGA products, Renesas changes the site from Amkor Technology Japan, Inc. Kumamoto (hereinafter referred as ATJ-Kumamoto) to Greatek Electronics Inc.Reason for Change: To serve the objective of stable supply against the obsolescence of manufacturing equipment.
Part Status:
Renesas RMLV1616AGBG-5S2#AC0 - Technical Attributes
| Memory Density: | 16Mb |
| Memory Organization: | 1 M x 16 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 55ns |
| Temperature Grade: | Industrial |
| Operating Temperature: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Interface Type: | Parallel |
| Package Style: | TFBGA-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
253 per Tray
Package Style:
TFBGA-48
Mounting Method:
Surface Mount