Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
ATMEGA8515L-8JU
ATmega Series 8 KB Flash 512 Byte SRAM 8 MHz 8-Bit Microcontroller - PLCC-44
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:PLCC-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATMEGA8515L-8JU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for FPCN 111800 ***Description of Change: Qualification of MTAI as a new final test site for AT89LP51RD2-20JU, AT89LP51ED2-20JU, AT89LP51ID2-20JU, AT89LP51RB2-20JU, AT89LP51RC2-20JU, ATMEGA8515-16JU, ATMEGA8515-16JUR, ATMEGA8515L-8JU and ATMEGA8515L-8JUR catalog part numbers (CPN) available in 44L PLCC (16.6x16.6x4.4m) package.Reason for Change: To improve manufacturability by qualifying MTAI as a new final test site.Estimated First Ship Date: 01 May 2025 (date code: 2518)Revision History: March 27, 2025: Issued final notification.April 02, 2025: Re-issued final notification to correct the Pre and Post Change Summary file.April 04, 2025: Re-issued final notification to adjust the Estimated First Ship Date to be on May 01, 2025. Updated the Timetable Summary for Estimated Implementation Date.
Description of Change:Qualification of MTAI as a new final test site for AT89LP51RD2-20JU, AT89LP51ED2-20JU, AT89LP51ID2-20JU, AT89LP51RB2-20JU, AT89LP51RC2-20JU, ATMEGA8515-16JU, ATMEGA8515-16JUR, ATMEGA8515L-8JU and ATMEGA8515L-8JUR catalog part numbers (CPN) available in 44L PLCC (16.6x16.6x4.4m) package.Pre and Post Summary Changes: See attached documentImpacts to Datasheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by qualifying MTAI as a new final test site.Change Implementation Status: In Progress Estimated First Ship Date: 27 May 2025 (date code: 2522)Note: Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Timetable Summary ; See attached documentEstimated First Ship Date:27 May 2025 (date code: 2522)Note: Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Timetable Summary:
**FPCN106608 UPDATE **Revision History:April 22, 2024: Issued initial notification.June 25, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 5, 2024.Description of Change:Qualification of MPHL as a new final test location for selected AT89C51RC, AT89C55WD, AT89LP51ED2, AT89LP51RB2, AT89LP51RC2, AT89LP51RD2, AT89LP52, AT89LP52QS840, AT89LS52, AT89S51, AT89S52, AT89S8253 and ATmega8515 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change:To improve manufacturability by qualifying MPHL as a new final test location.
Description of Change:Qualification of MPHL as a new final test location for selected AT89C51RC, AT89C55WD, AT89LP51ED2, AT89LP51RB2, AT89LP51RC2, AT89LP51RD2, AT89LP52, AT89LP52QS840, AT89LS52, AT89S51, AT89S52, AT89S8253 and ATmega8515 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change:To improve manufacturability by qualifying MPHL as a new final test location.
PCN Status:Initial NotificationDescription of Change:Qualification of MPHL as a new final test location for selected AT89C51RC, AT89C55WD, AT89LP51ED2, AT89LP51RB2, AT89LP51RC2, AT89LP51RD2, AT89LP52, AT89LP52QS840, AT89LS52, AT89S51, AT89S52, AT89S8253 and ATmega8515 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change:To improve manufacturability by qualifying MPHL as a new final test location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2024
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATMEGA8515L-8JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/7038208
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATMEGA8515L-8JU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/7038208
Microchip ATMEGA8515L-8JU - Technical Attributes
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 8kB |
| RAM Size: | 512B |
| Speed: | 8MHz |
| No of I/O Lines: | 35 |
| InterfaceType / Connectivity: | EBI/EMI/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 2 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| Watchdog Timers: | 1 |
| Package Style: | PLCC-44 |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
27 per Tube
Package Style:
PLCC-44
Mounting Method:
Surface Mount