
Manufacturer Part #
PIC16F690-I/ML
PIC16F Series 7 kB Flash 256 B RAM 20 MHz 8-Bit Microcontroller - QFN-20
Microchip PIC16F690-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of MPHL as an additional final test site for selected AR1010, AR1011, AR1020, AR1021, OUC16F1768, PIC16F15344, PIC16F1768, PIC16F1769, PIC16F18344, PIC16F18444, PIC16F18445, PIC16F18446, PIC16F527, PIC16F631, PIC16F677, PIC16F685, PIC16F687, PIC16F689 and PIC16F690 device families available in 20L QFN (4x4x0.9mm) and 20L UQFN (4x4x0.5mm) packages.Reason for Change: To improve manufacturability by qualifying MPHL as an additional final test site.Estimated First Ship Date: 09 August 2025 (date code: 2532)
Description of Change: Qualification of CRM1064L as an additional die attach material for selected AR10xx, DSPIC30F20xx, dsPIC30F10xx, MCP23xx, MCP42xx, MCP43xx, MCP44xx, MCP46xx, PIC16F6xx, PIC16F7xx, PIC18F2xx, WP200RX01 and WP300RX01 available in 16L VQFN (4x4x1.0mm), 20L QFN (4x4x0.9mm), 28L QFN-S (6x6x0.9mm) and 28L VQFN (6x6x1.0mm) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CRM1064L as an additional die attach material.Estimated First Ship Date: 04 August 2025 (date code: 2532)
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip PIC16F690-I/ML - Technical Attributes
Family Name: | PIC16 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 7kB |
RAM Size: | 256B |
Speed: | 20MHz |
No of I/O Lines: | 18 |
InterfaceType / Connectivity: | I2C/SPI/USART |
Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
Number Of Timers: | 3 |
Supply Voltage: | 2V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 12-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | QFN-20 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
91 per Tube
Package Style:
QFN-20
Mounting Method:
Surface Mount