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Manufacturer Part #
PLA110
PLA110 Series SPST 150 mA 400 V Single Channel Solid State Relay - DIP-6
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| Mfr. Name: | Littelfuse | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:50 per Tube Package Style:DIP-6 Mounting Method:Through Hole | ||||||||||
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Littelfuse PLA110 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description:Following the PCN EIC-1138, dated July 31st, 2024- Littelfuse IXYS Integrated Circuits Division (ICD) would like to inform you about additional pat numbers affected by this change.As a result, we need to remove the UL 94 V-0 flammability rating from the datasheets for the part numbers.Littelfuse would like to inform you that although components shipped from Littelfuse are considered to not have a UL 94 V-0 flammability rating, they remain fully compliant with the certifications outlined in their respective data sheets.
Additional Epoxy Mold Compound Qualification for 6L DIP devices:Detailed Description of Change:Littelfuse IXYS Integrated Circuits Division (ICD) would like to inform you about the qualification of an additional EMC (Epoxy Mold Compound) to ensure security of supply for the part numbers summarized in the table of the attached notice.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PLA110&field4=Littelfuse&field18=https://p1na.futureelectronics.com/p/8266595
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PLA110&field4=Littelfuse&field18=https://p1na.futureelectronics.com/p/8266595
Littelfuse PLA110 - Technical Attributes
| Contact Form: | SPST (1 Form A) |
| Output Voltage: | 400V |
| On-state Resistance-Max: | 22Ω |
| Input Voltage: | 1.2V |
| Input Current: | 50mA |
| Contact Current-Max: | 150mA |
| Isolation Voltage-RMS: | 3750V |
| Operating Temp Range: | -40°C to +85°C |
| Package Style: | DIP-6 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
50 per Tube
Package Style:
DIP-6
Mounting Method:
Through Hole