Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
MIC94045YFL-TR
MIC94045 Series 28 mΩ 3 A High Side Load Switch 1.2 x 1.2 mm Pkg SMT -MLF-4
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:MLF-4 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC94045YFL-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN115422**Revision History: August 20, 2025: Issued initial notification.September 23, 2025: Re-issued initial notification to update the LF drawings in the Pre and Post Change attachmentDescription of Change: Qualification of Matte Sn as a new lead plating for MIC94080YFT-TR, MIC94081YFT-TR, MIC94082YFT-TR, MIC94083YFT-TR, MIC94084YFT-TR, MIC94085YFT-TR, SPN015011-TR, MIC94043YFL-TR, MIC94044YFL-TR, MIC94045YFL-TR, MIC94040YFL-TR, MIC94041YFL-TR, MIC94042YFL-TR, MIC5019YFT-T5, MIC5019YFT-TR, MIC4415YFT-T5, MIC4414YFT-T5, MIC4414YFT-TR, and MIC4415YFT-TR catalog part numbers (CPN) available in 4L UDFN (0.85x0.85x0.6mm) and 4L UDFN (1.2x1.2x0.6mm) packages at UNIS assembly site.Reason for Change: To improve productivity by qualifying Matte Sn as a new lead plating.
Description of Change: Qualification of Matte Sn as a new lead plating for MIC94080YFT-TR, MIC94081YFT-TR, MIC94082YFT-TR, MIC94083YFT-TR, MIC94084YFT-TR, MIC94085YFT-TR, SPN015011-TR, MIC94043YFL-TR, MIC94044YFL-TR, MIC94045YFL-TR, MIC94040YFL-TR, MIC94041YFL-TR, MIC94042YFL-TR, MIC5019YFT-T5, MIC5019YFT-TR, MIC4415YFT-T5, MIC4414YFT-T5, MIC4414YFT-TR, and MIC4415YFT-TR catalog part numbers (CPN) available in 4L UDFN (0.85x0.85x0.6mm) and 4L UDFN (1.2x1.2x0.6mm) packages at UNIS assembly site.Reason for Change: To improve productivity by qualifying Matte Sn as a new lead plating.Estimated Qualification Completion Date: January 2026
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change: Qualification of UNIG as a new assembly site for selected UCS21xx, MIC23xx, MIC24xx, SPN01xx, MIC28xx, MIC33xx, MIC53xx, MIC50xx, MIC94xx, MIC74xx, SPN02xx, MIC44xx, MIC95xx, MIC30xx, and SPN95xx device families available in multiple packages.Reason for Change: To improve manufacturability by qualifying UNIG as the new assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC94045YFL-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/9012075
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC94045YFL-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/9012075
Microchip MIC94045YFL-TR - Technical Attributes
| Configuration: | High Side |
| Input Voltage: | 1.7V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 28mΩ |
| Rated Current-Max: | 3A |
| Package Style: | MLF-4 |
| Mounting Method: | Surface Mount |
Features & Applications
The MIC94045YFL TR is a high-side load switch designed to operate from 1.7 V to 5.5 V input voltage. Available in surface mount MLF-4 package.
This device provides a slew rate controlled soft-start turn-on of 1 ms (typical) to prevent an in-rush current event from pulling down the input supply voltage. It features an active load discharge circuit which switches in a 200 O load when the switch is disabled to automatically discharge a capacitive load.
Features:
- 28 mO RDSON
- 3 A continuous operating current
- 1.2 mm x 1.2 mm space saving 4-pin MLF package
- 1.7 V to 5.5 V input voltage range
- Internal level shift for CMOS/TTL control logic
- Ultra low quiescent current
- Micro-power shutdown current
- Soft-Start: 1 ms
- Load discharge circuit: MIC94045
- Ultra fast turn off time
- Junction operating temperature from -40 °C to +125 °C
Applications:
- Solid State Drives (SSD)
- Cellular phones
- Portable Navigation Devices (PND)
- Personal Media Players (PMP)
- Ultra Mobile PCs
- Portable instrumentation
- Other Portable applications
- PDAs
- Industrial and DataComm equipment
View the available MIC9404x series of load switches
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-4
Mounting Method:
Surface Mount