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Manufacturer Part #
IM241L6T2BAKMA1
Download the CAD models for this product. Learn more about SnapMagic.
15 per Tube
DIP-23
Through Hole
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Detailed change informationSubject: Add data matrix (DMX) code to marking. The DMX code contains lot number, date code and sales name.Reason: Improved traceability and possibility for automated read-out of device data.Intended start of delivery From March 2025 onwards
Detailed change information:Subject Introduction of an additional wafer production at Silicon Foundry Vanguard International Semiconductor Corporation, Taiwan for Gen5/5.2 Gate Driver ICs.Reason:Expansion of wafer production to assure continuity of supply and enable flexible manufacturing.
Update on Supplier PCN 2022-0561 - Future PCN 97634 with additional part list.Detailed change information Subject: Introduction of an additional FE wafer site production. Reason: Capacity extension and implementation of a 2nd source.
Detailed change information Subject: Introduction of an additional FE wafer site production. Reason: Capacity extension and implementation of a 2nd source.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
