Manufacturer Part #
PIC18F6680-I/PT
PIC18F Series 64 kB Flash 3328 B RAM SMT 8-Bit Microcontroller - TQFP-64
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-64 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2433 | ||||||||||
Microchip PIC18F6680-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
Microchip PIC18F6680-I/PT - Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 3328B |
| Speed: | 40MHz |
| No of I/O Lines: | 53 |
| InterfaceType / Connectivity: | CAN/I2C/SPI/USART |
| Peripherals: | Analog Comparators/CAN/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 4.2V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 12-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-64 |
| Mounting Method: | Surface Mount |
Features & Applications
Ideal for low power (nanoWatt) and connectivity applications that benefit from the availability of four serial ports: FS-USB(12 Mbit/s), MI²C and SPI (up to 10 Mbit/s) and an asynchronous (LIN capable) two serial port (EUSART). Large amounts of RAM memory for buffering and Enhanced Flash program memory make it ideal for embedded control and monitoring applications that require periodic connection with a (legacy free) personal computer via USB for data upload/download and/or firmware updates.
Features:
- High-Performance RISC CPU:
- Source code compatible with the PIC16 and PIC17 instruction sets
- Linear program memory addressing to 2 Mbytes
- Linear data memory addressing to 4096 bytes
- 1 Kbyte of data EEPROM
- External Memory Interface:
- Address capability of up to 2 Mbytes
- 16-bit interface
- Peripheral Features:
- High current sink/source 25 mA/25 mA
- Four external interrupt pins
- Timer0 module: 8-bit/16-bit timer/counter
- Timer1 module: 16-bit timer/counter
- Timer2 module: 8-bit timer/counter
- Timer3 module: 16-bit timer/counter
- Secondary oscillator clock option – Timer1/Timer3
- Analog Features:
- Up to 16-channel, 10-bit Analog-to-Digital Converter module (A/D) with:
- Fast sampling rate
- Programmable acquisition time
- Conversion available during Sleep
- Programmable 16-level Low-Voltage Detection (LVD) module:
- Supports interrupt on Low-Voltage Detection
- Up to 16-channel, 10-bit Analog-to-Digital Converter module (A/D) with:
- ECAN Module Features:
- Message bit rates up to 1 Mbps
- Conforms to CAN 2.0B ACTIVE Specification
- Fully backward compatible with PIC18XXX8 CAN modules
- Three modes of operation:
- Legacy, Enhanced Legacy, FIFO
- Three dedicated transmit buffers with prioritization
- Special Microcontroller Features:
- 100,000 erase/write cycle Enhanced Flash program memory typical
- 1,000,000 erase/write cycle Data EEPROM memory typical
- 1-second programming time
- Flash/Data EEPROM Retention: > 40 years
- Self-reprogrammable under software control
- Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
- Watchdog Timer (WDT) with its own On-Chip RC Oscillator
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount