Manufacturer Part #
MCP6024T-E/SL
MCP6024 Series 5.5 V 10 MHz Rail-to-Rail I/O Operational Amplifier SOIC-14
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2600 per Reel Package Style:SOIC-14 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2010 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 8L and 14L SOIC package at MTAI assembly site.Pre Change: Using Palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date: February 22, 2018 (date code: 1808)
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| No of Channels: | 4 |
| Slew Rate-Nom: | 7V/µs |
| Input Offset Voltage-Max: | 500µV |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2600 per Reel
Package Style:
SOIC-14
Mounting Method:
Surface Mount
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