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Manufacturer Part #
MCP606-I/SN
MCP606 Series 6 V 155 kHz Micropower CMOS Operational Amplifier - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount |
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Microchip MCP606-I/SN - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: Linear Comparators, Linear Op AmpsDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected MCP601, MCP603, MCP6041, MCP6043, MCP606, MCP608, MCP6141, MCP6143, MCP616, MCP6231, MCP6241, MCP6271, MCP6273, MCP6281, MCP6283, MCP6291, MCP6293, MCP6541, MCP6546, MCP6L1 and MCP6L71 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: March 2026
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
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Microchip MCP606-I/SN - Technical Attributes
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.08V/µs |
| Input Offset Voltage-Max: | 250µV |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP606-I/SN is a MCP606 Series operational amplifier (op amp) has a gain bandwidth product of 155 kHz with a low typical operating current of 18.7 and an offset voltage that is less than 250 µV. The MCP606 uses Microchip's advanced CMOS technology, which provides low bias current, high-speed operation, high open-loop gain and rail-to-rail output swing.
The MCP606 operates with a single supply voltage that can be as low as 2.5V, while drawing less than 25 of quiescent current. The MCP606 is available in standard 8-lead PDIP, SOIC, TSSOP and 6-lead SOT-23A packages. This amplifier is ideal for battery and loop-powered applications as well as industrial process control, low-power battery-operated devices, portable equipment, data acquisition equipment, test equipment and low-end audio applications.
Features:
- Low Input Offset Voltage: 250 μV (maximum)
- Rail-to-Rail Output
- Low Input Bias Current: 80 pA (maximum at +85°C)
- Low Quiescent Current: 25 μA (maximum)
- Power Supply Voltage: 2.5 V to 6.0 V
- Unity-Gain Stable
- Chip Select (CS) Capability: MCP608
- Industrial Temperature Range: -40°C to +85°C
- No Phase Reversal
- Available in Single, Dual and Quad Packages
Applications:
- Battery Power Instruments
- High-Impedance Applications
- Strain Gauges
- Medical Instruments
- Test Equipment
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount