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Manufacturer Part #
APTGT400A60D3G
APTGT400x Series 600 V 500 A Chassis Mount IGBT Power Module - D3
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:1 per Tube Package Style:Module Mounting Method:Chassis Mount |
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Microchip APTGT400A60D3G - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change:Implement new protective packing material changes (Rivet) for selected APTGLxxx, APTGTxxx, APTGX300xx, APTGX400xx, APTGX600xx, APTM1xx, CMATSM120x, CMCFSM170x, CMDGSM170x, CMIVSM170x, CMSAM15Ax, MSCSM120xx, MSCSM170xxx, MSCSM330xxx, MSCSM70xx and MSCSMC120xx device families available in Module package at MP3B assembly site.Reason for Change:To improve productivity by implementing new protective packing material changes (Rivet).
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Implementation of D3-Signal Connector Wedge (MP0360) for selected SIC and IPS products of APTGT300x and MSCSM120AMx device families and CMCFSM170AM058CD3AG, MSCSM70AM025D3AG, MSCSM330DUM07D3AG, CMIVSM170AM058D3AG, MSCSM70AM025CD3AG, MSCSM170AM058CD3AG, MSCSM170AM039CD3AG, CMIVSM170AM039D3AG, CMDGSM170AM039CD3AG, APTMC120AM08CD3AG, CMSAM15AM01D3AG, APTM10AU70D3AG, APTM15AM01D3AG, APTGT400A60D3G, APTGT400A120D3G, APTGL325A120D3G, APTGL475A120D3G, catalog part numbers (CPN).Reason for Change:To improve productivity by implementing D3-Signal Connector Wedge (MP0360).Change Implementation Status:In ProgressEstimated First Ship Date:20 November 2024 (date code: 2447)
Description of Change:Qualification of MP3B as a new assembly site for selected APTGxx, APTMxx, CMCFSxx, CMGEGxx, CMIVSxx, CMSAMxx, CMTHDxx, MSCDxx and MSCSxx device families available in various packages.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MP3B as a new assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:November 08, 2023 (date code: 2345)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APTGT400A60D3G&field4=Microchip&field18=https://p1na.futureelectronics.com/p/discretes--transistors--igbts/aptgt400a60d3g-microsemi-2034604
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APTGT400A60D3G&field4=Microchip&field18=https://p1na.futureelectronics.com/p/discretes--transistors--igbts/aptgt400a60d3g-microsemi-2034604
Microchip APTGT400A60D3G - Technical Attributes
| CE Voltage-Max: | 600V |
| Collector Current @ 25C: | 500A |
| Power Dissipation-Tot: | 1250W |
| Gate - Emitter Voltage: | ±20V |
| Pulsed Collector Current: | 800A |
| Collector - Emitter Saturation Voltage: | 1.5V |
| Turn-on Delay Time: | 110ns |
| Turn-off Delay Time: | 490ns |
| Qg Gate Charge: | 4200nC |
| Reverse Recovery Time-Max: | 125ns |
| Leakage Current: | 500µA |
| Input Capacitance: | 24nF |
| Thermal Resistance: | 0.12°C/W |
| Operating Temp Range: | -40°C to +175°C |
| Package Style: | Module |
| Mounting Method: | Chassis Mount |
Available Packaging
Package Qty:
1 per Tube
Package Style:
Module
Mounting Method:
Chassis Mount