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Manufacturer Part #
CS45-08IO1
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30 per Tube
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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ECCN:
PCN Information:
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Effective date : Jan 2, 2026
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Form, fit, function changes : No changeEffective date : Jan 2, 2026
Littelfuse would like to notify you that we have qualified alternative Epoxy Molding Compound (EMC) material for various IXYS Brand Thyristor & Diode Discrete Packages to serve the Business Continuity Plan (BCP).Package types includes : TO-262, TO-3P, TO-247, SOT227, TO-268, TO-263, TO-220.All affected IXYS Brand Thyristor & Diode Discrete products have been fully qualified in accordance with established performance and reliability criteria using alternative EMC. The attached pages summarized the qualification results. Full qualification data and/or samples will be available upon request.Form, fit, function changes: No Fit/Form/Function change with alternative EMC.Effective date: August 10th, 2024
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 - IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement.
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 -IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number list refer to Appendix.
Here is a update regarding our previous ESW490-44 PCN. Nowadays we completed qualification for TO247 Diode portfolio in Lipa thus we would get your help to communicate to our customers regarding this new update.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Notification of Thyristor & Diode TO-247 Package MOQ Change _ Phase 1 This is a declaration letter to state that Littelfuse will change the MOQ for Thyristor & Diode TO-247 Package products aligning to manufacture requirement. Detail affected part number list refer to Appendix. There will be no change on product fit, form, function, and no change to MPQ/Packing Mode.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
